

|
Silver-based
solder

Silver-based solder is a solder with silver or
silver base, which has excellent technical property, low melting temperature,
good moist and penetration ability as well as high rigidity, good plasticity,
electric condution, and good anti-corrosion. With the support of silver
solder agent, it can be used in all black metal and non-ferrous metals except
aluminum, magnesium, and some metals with lower melting point.
| Product
license number |
BAg9CuZnCd |
BAg10CuZn |
BAg15CuZnSn |
BAg18CuZnSn |
BAg20CuZnCdSi |
| Chemical
contents% |
Ag |
8.5~9.5 |
9~11 |
14.5~15.5 |
17.5~18.5 |
19.5~20.5 |
| Cu |
45~48 |
52~54 |
46~48 |
46~47 |
36~38 |
| Zn |
rest |
rest |
rest |
rest |
rest |
| Cd |
8~9.5 |
|
|
|
13~15 |
| Others |
3.5~4.5 |
|
0.1~0.4 |
1~3 |
0.1~0.4 |
| Total
volume of impurities |
≤0.25 |
≤0.15 |
≤0.25 |
| Melting
temperature(℃) |
Fixed
phase line |
720 |
815 |
787 |
686 |
620 |
| Liquid phase
line |
750 |
850 |
808 |
800 |
730 |
| Soldering
temperature(℃)
(reference value) |
750~850 |
850~950 |
810~890 |
800~850 |
730~800 |
| Replace
license number |
QCu9Ag |
feed301
HLAgCu-53-37 |
QCu15Ag |
|
QCu20Ag |
| Product
license number |
BAg25CuZn |
Ag30CuZnCd |
BAg35CuZnCd |
BAg40CuZnCdNi |
BAg40CuZnSnNi |
| Chemical
contents% |
Ag |
24~26 |
29~31 |
34~36 |
39~41 |
39~41 |
| Cu |
40~42 |
27~29 |
25~29 |
15.5~16.5 |
24~26 |
| Zn |
33~35 |
余 |
19~23 |
17.3~18.5 |
29.5~31.5 |
| Cd |
|
20~22 |
17~19 |
25.1~26.5 |
|
| Others |
|
|
|
0.1~0.3 |
1.3~1.65
2.7~3.3 |
| Total
volume of impurities |
≤0.15 |
| Melting
temperature(℃) |
Fixed
phase line |
700 |
600 |
605 |
595 |
634 |
| Liquid phase
line |
800 |
690 |
700 |
605 |
640 |
| Soldering
temperature(℃)
(reference value) |
800~890 |
720~840 |
700~845 |
605~705 |
640~740 |
| Replace
license number |
feed302
HLAgCu-90-35 |
feed311 |
feed314 |
feed312 |
|
| Product
license number |
BAg45CuZn |
BAg50CuZn |
BAg50CuZnCdNi |
BAg60CuSn |
BAg72Cu |
| Chemical
contents% |
Ag |
44~46 |
49~51 |
49~51 |
59~61 |
71~73 |
| Cu |
29~31 |
33~35 |
14.5~16.5 |
60 |
|
| Zn |
23~27 |
14~18 |
13.5~17.5 |
rest quantity |
|
| Cd |
|
|
15~17 |
9.5~10.5 |
|
| Others |
|
|
2.5~3.5 |
|
|
| Total
volume of impurities |
≤0.15 |
| Melting
temperature(℃) |
Fixed
phase line |
665 |
690 |
630 |
600 |
779 |
| Liquid phase
line |
745 |
775 |
690 |
720 |
779 |
| Soldering
temperature(℃)
(reference value) |
745~845 |
775~870 |
690~815 |
720~840 |
800~900 |
| Replace
license number |
feed303
HLAgCu-30-25 |
feed304 |
feed315 |
|
feed308
HLAgCu28 |
|