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Copper phosphor and silver solder

　　Copper and phosphor solder is added silver based on copper and phosphor alloy.
　　At 8.38％P, Copper and phosphor alloy form eutectic, which is composed of a+Cu3P, with its melting temperature of 714℃, crisp for Cu3P. With the addition of silver into the copper and phosphor alloy can improve the mechanic property and fabrication properties and further enhance the anti-tensility strength, lower the melting point. It has good electric conduction, satisfying moisture, and filling ability.
Product license No.
Chemical contents (%)
Melting temperature(℃)
Soldering temperature(℃)
(reference value)
Replace
license number
P
Ag
Sn
Cu
Total volume of impurities
Fixed phase line
Liquid phase line
BCu80PAg
4.8～5.3
14.5～15.5

rest


quantity
≤0.15
640
815
704～816
feed204
BCu88PAg*
6.0～6.5
4.8～5.2
640
815
710～825
feed205
BCu88PAg
6.0～7.0
4.8～5.2
640
815
710～825
feed205
BCu80PSnAg
4.8～5.3
4.5～5.5
9.5～10.5
560
650
600～660
feed207
BCu91PAg**
6.5～7.2
1.8～2.2
640
750
680～800
BCu91PAg
6.0～7.0
1.8～2.2
640
750
680～800